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 CY7C1011CV33
128K x 16 Static RAM
Features
* Pin equivalent to CY7C1011BV33 * High speed -- tAA = 10 ns * Low active power -- 360 mW (max.) * Data Retention at 2.0 * Automatic power-down when deselected * Independent control of upper and lower bits * Easy memory expansion with CE and OE features * Available in 44-pin TSOP II, 44-pin TQFP, and 48-ball VFBGA written into the location specified on the address pins (A0 through A16). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A16). Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O8 to I/O15. See the truth table at the back of this data sheet for a complete description of read and write modes. The input/output pins (I/O0 through I/O15) are placed in a high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), the BHE and BLE are disabled (BHE, BLE HIGH), or during a write operation (CE LOW, and WE LOW). The CY7C1011CV33 is available in a standard 44-pin TSOP II package with center power and ground pinout, a 44-pin Thin Plastic Quad Flatpack (TQFP), as well as a 48-ball fine-pitch ball grid array (VFBGA) package.
Functional Description
The CY7C1011CV33 is a high-performance CMOS Static RAM organized as 131,072 words by 16 bits. Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is
Logic Block Diagram
INPUT BUFFER
Pin Configuration
TSOP II Top View A4 A3 A2 A1 A0 CE I/O0 I/O1 I/O2 I/O3 VCC VSS I/O4 I/O5 I/O6 I/O7 WE A16 A15 A14 A13 A12
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
A0 A1 A2 A3 A4 A5 A6 A7 A8
256K x 16 ARRAY 1024 x 4096
I/O0 - I/O7 I/O8 - I/O15
COLUMN DECODER
BHE WE CE OE BLE
A5 A6 A7 OE BHE BLE I/O15 I/O14 I/O13 I/O12 VSS VCC I/O11 I/O10 I/O9 I/O8 NC A8 A9 A10 A11 NC
ROW DECODER
Cypress Semiconductor Corporation Document #: 38-05232 Rev. *B
A9 A10 A 11 A 12 A 13 A14 A15 A16
SENSE AMPS
*
3901 North First Street
*
San Jose
*
CA 95134 * 408-943-2600 Revised October 10, 2002
CY7C1011CV33
Selection Guide
-10 Maximum Access Time Maximum Operating Current Comm'l Ind'l Maximum CMOS Standby Current Com'l/Ind'l 10 90 100 10 -12 12 85 95 10 -15 15 80 90 10 mA Unit ns mA
Pin Configurations
44-pin TQFP (Top View)
BHE A16 BLE A13 A15 A14 A11 A10 OE A12 A9
1 CE I/O0 I/O1 I/O2 I/O3 VCC VSS I/O4 I/O5 I/O6 I/O7 I/O15 I/O14 I/O13 I/O12 VSS VCC I/O11 I/O10 I/O9 I/O8 NC
WE A0
NC
A1
A5
A2
A6
A3
48-ball VFBGA (Top View)
1 BLE I/O8 I/O9 VSS VCC I/O14 I/O15 NC 2 OE BHE I/O10 3 A0 A3 A5 4 A1 A4 A6 A7 A16 A15 A13 A10 5 A2 CE I/O1 I/O3 I/O4 I/O5 WE A11 6 NC I/O0 I/O2 VCC VSS I/O6 I/O7 NC A B C D E F G H
I/O11 NC I/O12 I/O13 NC A8 NC A14 A12 A9
Document #: 38-05232 Rev. *B
A4
A7
A8
Page 2 of 11
CY7C1011CV33
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature .................................-65C to +150C Ambient Temperature with Power Applied............................................. -55C to +125C Supply Voltage on VCC to Relative GND
[2]
DC Input Voltage[2] ................................ -0.5V to VCC + 0.5V Current into Outputs (LOW)......................................... 20 mA
Operating Range
Range Commercial Industrial Ambient Temperature 0C to +70C -40C to +85C VCC 3.3V 0.3V
.... -0.5V to +4.6V
DC Voltage Applied to Outputs in High-Z State[2] ....................................-0.5V to VCC + 0.5V
DC Electrical Characteristics Over the Operating Range
-10 Parameter VOH VOL VIH VIL IIX IOZ ICC Description Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage[1] Input Load Current GND < VI < VCC Output Leakage Current GND < VOUT < VCC, Output Disabled VCC Operating Supply Current Automatic CE Power-down Current --TTL Inputs Automatic CE Power-down Current --CMOS Inputs VCC = Max., f = fMAX = 1/tRC Max. VCC, CE > VIH VIN > VIH or VIN < VIL, f = fMAX Max. VCC, CE > VCC - 0.3V, VIN > VCC - 0.3V, or VIN < 0.3V, f = 0 Com'l/ Ind'l Com'l Ind'l ISB1 Test Conditions VCC = Min., IOH = -4.0 mA VCC = Min., IOL = 8.0 mA 2.0 -0.3 -1 -1 Min. 2.4 0.4 VCC + 0.3 0.8 +1 +1 90 100 40 2.0 -0.3 -1 -1 Max. Min. 2.4 0.4 VCC + 0.3 0.8 +1 +1 85 95 40 2.0 -0.3 -1 -1 -12 Max. Min. 2.4 0.4 VCC + 0.3 0.8 +1 +1 80 90 40 -15 Max. Unit V V V V A A mA mA mA
ISB2
10
10
10
mA
Capacitance[2]
Parameter CIN COUT Description Input Capacitance I/O Capacitance Test Conditions TA = 25C, f = 1 MHz, VCC = 3.3V Max. 8 8 Unit pF pF
Notes: 1. VIL (min.) = -2.0V for pulse durations of less than 20 ns. 2. Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05232 Rev. *B
Page 3 of 11
CY7C1011CV33
AC Test Loads and Waveforms[3]
10-ns devices: OUTPUT 50 * CAPACITIVE LOAD CONSISTS OF ALL COMPONENTS OF THE TEST ENVIRONMENT 1.5V 12-, 15-ns devices: Z = 50 3.3V R 317
30 pF*
OUTPUT 30 pF R2 351
(a)
(b)
High-Z characteristics: R 317
3.0V 90% GND 10%
ALL INPUT PULSES 90% 10%
3.3V OUTPUT 5 pF R2 351
Rise Time: 1 V/ns
(c)
Fall Time: 1 V/ns
(d)
AC Switching Characteristics Over the Operating Range [4]
-10 Parameter Read Cycle tpower[5] tRC tAA tOHA tACE tDOE tLZOE tHZOE tLZCE tHZCE tPU tPD tDBE tLZBE tHZBE Write Cycle[8, 9] tWC Write Cycle Time 10 12 15 ns
Notes: 3. AC characteristics (except High-Z) for all 10-ns parts are tested using the load conditions shown in (a). All other speeds are tested using the Thevenin load shown in (b). High-Z characteristics are tested for all speeds using the test load shown in (d). 4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V. 5. tPOWER gives the minimum amount of time that the power supply should be at typical VCC values until the first memory access is performed. 6. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (d) of AC Test Loads. Transition is measured 500 mV from steady-state voltage. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 8. The internal write time of the memory is defined by the overlap of CE LOW, and WE LOW. CE and WE must be LOW to initiate a write, and the transition of either of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write. 9. The minimum write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
-12 Max. Min. 1 12 10 12 3 10 5 12 6 0 5 6 3 5 6 0 10 5 12 6 0 6 6 0 0 3 0 3 Max. Min. 1 15
-15 Max. Unit s ns 15 15 7 7 7 15 7 7 ns ns ns ns ns ns ns ns ns ns ns ns ns
Description VCC(typical) to the first access Read Cycle Time Address to Data Valid Data Hold from Address Change CE LOW to Data Valid OE LOW to Data Valid OE LOW to Low-Z OE HIGH to High-Z[6, 7] CE LOW to CE HIGH to Low-Z[7] High-Z[6, 7]
Min. 1 10 3
0 3 0
CE LOW to Power-up CE HIGH to Power-down Byte Enable to Data Valid Byte Enable to Low-Z Byte Disable to High-Z
0
Document #: 38-05232 Rev. *B
Page 4 of 11
CY7C1011CV33
AC Switching Characteristics Over the Operating Range (continued)[4]
-10 Parameter tSCE tAW tHA tSA tPWE tSD tHD tLZWE tHZWE tBW Description CE LOW to Write End Address Set-up to Write End Address Hold from Write End Address Set-up to Write Start WE Pulse Width Data Set-up to Write End Data Hold from Write End WE HIGH to Low-Z
[7]
-12 Max. Min. 8 8 0 0 8 6 0 3 5 6 8 10 Max. Min. 10 10 0 0 10 7 0 3
-15 Max. Unit ns ns ns ns ns ns ns ns 7 ns ns
Min. 7 7 0 0 7 5 0 3 7
WE LOW to High-Z[6, 7] Byte Enable to End of Write
Data Retention Waveform
DATA RETENTION MODE VCC 3.0V tCDR CE VDR > 2V 3.0V tR
Switching Waveforms
Read Cycle No. 1[10, 11]
tRC ADDRESS tAA tOHA DATA OUT PREVIOUS DATA VALID DATA VALID
Notes: 10. Device is continuously selected. OE, CE, BHE and/or BHE = VIL. 11. WE is HIGH for read cycle.
Document #: 38-05232 Rev. *B
Page 5 of 11
CY7C1011CV33
Switching Waveforms (continued)
Read Cycle No. 2 (OE Controlled) [11, 12]
ADDRESS tRC CE tACE OE BHE, BLE tDOE tLZOE tDBE tLZBE HIGH IMPEDANCE tLZCE VCC SUPPLY CURRENT tPU 50% tHZCE tHZBE DATA VALID tPD 50% IISB SB IICC CC tHZOE
DATA OUT
HIGH IMPEDANCE
Write Cycle No. 1 (CE Controlled)[13, 14]
tWC ADDRESS
CE
tSA
tSCE
tAW tPWE WE t BW BHE, BLE tSD DATAI/O tHD
tHA
Notes: 12. Address valid prior to or coincident with CE transition LOW. 13. Data I/O is high-impedance if OE or BHE and/or BLE = VIH. 14. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
Document #: 38-05232 Rev. *B
Page 6 of 11
CY7C1011CV33
Switching Waveforms (continued)
Write Cycle No. 2 (BLE or BHE Controlled)
tWC ADDRESS
BHE, BLE
tSA
tBW
tAW tPWE WE tSCE CE tSD DATAI/O tHD
tHA
Write Cycle No. 3 (WE Controlled,
tWC ADDRESS
CE
tSCE
tAW tSA tPWE
tHA
WE tBW BHE, BLE tHZWE DATA I/O tLZWE tSD tHD
Document #: 38-05232 Rev. *B
Page 7 of 11
CY7C1011CV33
Truth Table
CE H L L L L L L L OE X L L L X X X H WE X H H H L L L H BLE X L L H L L H X BHE X L H L L H L X I/O0-I/O7 High-Z Data Out Data Out High-Z Data In Data In High-Z High-Z I/O8-I/O15 High-Z Data Out High-Z Data Out Data In High-Z Data In High-Z Power-down Read All Bits Read Lower Bits Only Read Upper Bits Only Write All Bits Write Lower Bits Only Write Upper Bits Only Selected, Outputs Disabled Mode Power Standby (ISB) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC)
Ordering Information
Speed (ns) 10 Ordering Code CY7C1011CV33-10ZC CY7C1011CV33-10BVC CY7C1011CV33-10ZI CY7C1011CV33-10BVI CY7C1011CV33-12ZC CY7C1011CV33-12AC CY7C1011CV33-12BVC CY7C1011CV33-12ZI CY7C1011CV33-12AI CY7C1011CV33-12BVI CY7C1011CV33-15ZC CY7C1011CV33-15AC CY7C1011CV33-15BVC CY7C1011CV33-15ZI CY7C1011CV33-15AI CY7C1011CV33-15BVI Package Name Z44 BV48A Z44 BV48A Z44 A44 BV48A Z44 A44 BV48A Z44 A44 BV48A Z44 A44 BV48A Package Type 44-pin TSOP II 48-ball VFBGA 44-pin TSOP II 48-ball VFBGA 44-pin TSOP II 44-pin TQFP 48-ball VFBGA 44-pin TSOP II 44-pin TQFP 48-ball VFBGA 44-pin TSOP II 44-pin TQFP 48-ball VFBGA 44-pin TSOP II 44-pin TQFP 48-ball VFBGA Operating Range Commercial Industrial Commercial
12
Industrial
15
Commercial
Industrial
Document #: 38-05232 Rev. *B
Page 8 of 11
CY7C1011CV33
Package Diagrams
44-Pin TSOP II Z44
51-85087-*A
44-Lead Thin Plastic Quad Flat Pack A44
51-85064-*B
Document #: 38-05232 Rev. *B
Page 9 of 11
CY7C1011CV33
Package Diagrams (continued)
48-Lead VFBGA (6 x 8 x 1 mm) BV48A
51-85150-*A
All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-05232 Rev. *B
Page 10 of 11
(c) Cypress Semiconductor Corporation, 2002. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
CY7C1011CV33
Document History Page
Document Title: CY7C1011CV33 128K x 16 Static RAM Document Number: 38-05232 REV. ** *A *B ECN NO. 117132 118057 119702 Issue Date 07/31/02 08/19/02 10/11/02 Orig. of Change HGK HGK DFP New Data Sheet Pin configuration for 48-ball FBGA correction Updated FBGA to VFBGA; updated package code on page 8 to BV48A. Updated address pinouts on page 1 to A0 to A16. Updated CMOS standby current on page 1 from 8 to 10 mA. Description of Change
Document #: 38-05232 Rev. *B
Page 11 of 11


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